APA (7th ed.) Citation

Mu, W., Wang, L., Jin, H., Hu, B., Wang, B., Zhang, J., . . . Long, T. Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module. IEEE.

Chicago Style (17th ed.) Citation

Mu, Wei, Laili Wang, Haoyuan Jin, Borong Hu, Binyu Wang, Jinfeng Zhang, Liang Wang, and Teng Long. Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module. IEEE.

MLA (9th ed.) Citation

Mu, Wei, et al. Near Junction Integration of Vapor Chamber for Transient Thermal Performance Improvements of SiC Power Module. IEEE.