Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines
To overcome the bottleneck of the die-attach process in the manufacture of power modules based utilizing band gap semiconductors, an extremely fast pressure-assisted sinter-bonding method employing a low-cost Cu paste was developed. Ultrafine dendritic Cu particles with maximized surface areas were...
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Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425002613 |
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| author | Sang Hoon Jung Jong-Hyun Lee |
| author_facet | Sang Hoon Jung Jong-Hyun Lee |
| author_sort | Sang Hoon Jung |
| collection | DOAJ |
| description | To overcome the bottleneck of the die-attach process in the manufacture of power modules based utilizing band gap semiconductors, an extremely fast pressure-assisted sinter-bonding method employing a low-cost Cu paste was developed. Ultrafine dendritic Cu particles with maximized surface areas were synthesized via a wet process using a catalyst, mixed with a high-performance reducing solvent, and prepared as a paste to evaluate their sinter-bonding properties. The synthesized ultrafine dendrites exhibited slightly larger d50 values than their original counterparts; however, as aggregates of smaller nanoparticles, they demonstrated significantly finer morphologies and more than two-fold larger surface area per unit weight. These morphological changes in the dendrites directly affected the thermal behavior of the paste and the sintering behavior of the dendrites. As a result, the bond line formed using the ultrafine Cu dendrite paste exhibited an exceptional shear strength of 42.8 MPa after only 10 s of bonding under 10 MPa compression at 300 °C in air. Furthermore, the formation of a near-full-density bond line microstructure without dendritic particle shapes or coarse voids was achieved. The finer stems and branches facilitated bending deformation during sinter-bonding, and the expanded surface area increased the contact area between the dendrites and the in situ reduction-generated Cu nanoparticles. These factors collectively led to near-complete sinter-bonding within 10 s. Furthermore, freeze-dried ultrafine Cu dendrites exhibited improved dispersion, resulting in a bond line shear strength exceeding 50 MPa (50.6 MPa) and the densest observed bulk microstructure after 10 s of bonding. |
| format | Article |
| id | doaj-art-47241f8b9d1547a892805b02b4629610 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-03-01 |
| publisher | Elsevier |
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| series | Journal of Materials Research and Technology |
| spelling | doaj-art-47241f8b9d1547a892805b02b46296102025-02-08T05:00:32ZengElsevierJournal of Materials Research and Technology2238-78542025-03-013530453057Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond linesSang Hoon Jung0Jong-Hyun Lee1Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul, 01811, Republic of KoreaDepartment of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul, 01811, Republic of Korea; Research Institute for Future Convergence Materials, Seoul National University of Science and Technology, Seoul, 01811, Republic of Korea; Corresponding author. Department of Materials Science and Engineering, Seoul National University of Science and Technology, Seoul, 01811, Republic of Korea.To overcome the bottleneck of the die-attach process in the manufacture of power modules based utilizing band gap semiconductors, an extremely fast pressure-assisted sinter-bonding method employing a low-cost Cu paste was developed. Ultrafine dendritic Cu particles with maximized surface areas were synthesized via a wet process using a catalyst, mixed with a high-performance reducing solvent, and prepared as a paste to evaluate their sinter-bonding properties. The synthesized ultrafine dendrites exhibited slightly larger d50 values than their original counterparts; however, as aggregates of smaller nanoparticles, they demonstrated significantly finer morphologies and more than two-fold larger surface area per unit weight. These morphological changes in the dendrites directly affected the thermal behavior of the paste and the sintering behavior of the dendrites. As a result, the bond line formed using the ultrafine Cu dendrite paste exhibited an exceptional shear strength of 42.8 MPa after only 10 s of bonding under 10 MPa compression at 300 °C in air. Furthermore, the formation of a near-full-density bond line microstructure without dendritic particle shapes or coarse voids was achieved. The finer stems and branches facilitated bending deformation during sinter-bonding, and the expanded surface area increased the contact area between the dendrites and the in situ reduction-generated Cu nanoparticles. These factors collectively led to near-complete sinter-bonding within 10 s. Furthermore, freeze-dried ultrafine Cu dendrites exhibited improved dispersion, resulting in a bond line shear strength exceeding 50 MPa (50.6 MPa) and the densest observed bulk microstructure after 10 s of bonding.http://www.sciencedirect.com/science/article/pii/S2238785425002613Ultrafine dendritePressure-assisted sinter-bondingSurface areaBonding speedBond-line densityShear strength |
| spellingShingle | Sang Hoon Jung Jong-Hyun Lee Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines Journal of Materials Research and Technology Ultrafine dendrite Pressure-assisted sinter-bonding Surface area Bonding speed Bond-line density Shear strength |
| title | Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines |
| title_full | Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines |
| title_fullStr | Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines |
| title_full_unstemmed | Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines |
| title_short | Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines |
| title_sort | ultrafine dendritic cu particles for extremely fast pressure assisted sintering under air and pore free bond lines |
| topic | Ultrafine dendrite Pressure-assisted sinter-bonding Surface area Bonding speed Bond-line density Shear strength |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425002613 |
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