Ultrafine dendritic Cu particles for extremely fast pressure-assisted sintering under air and pore-free bond lines
To overcome the bottleneck of the die-attach process in the manufacture of power modules based utilizing band gap semiconductors, an extremely fast pressure-assisted sinter-bonding method employing a low-cost Cu paste was developed. Ultrafine dendritic Cu particles with maximized surface areas were...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425002613 |
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