To suppress tin whisker growth by using (100)-oriented copper
Effect of Cu crystallographic orientations on the Sn whisker growth is investigated in this study. Three types of Cu under-layer (randomly, <111>, <100>-oriented) were prepared for electroplating of pure Sn. After 672 h of room temperature (RT) storage, a lot of whiskers were found on th...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-03-01
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| Series: | Journal of Materials Research and Technology |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425002686 |
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| author | Han-Wen Lin Jia-Ling Lu Chih-Chia Hu K.N. Tu Chih Chen |
| author_facet | Han-Wen Lin Jia-Ling Lu Chih-Chia Hu K.N. Tu Chih Chen |
| author_sort | Han-Wen Lin |
| collection | DOAJ |
| description | Effect of Cu crystallographic orientations on the Sn whisker growth is investigated in this study. Three types of Cu under-layer (randomly, <111>, <100>-oriented) were prepared for electroplating of pure Sn. After 672 h of room temperature (RT) storage, a lot of whiskers were found on the Sn surface electroplated on the randomly-oriented Cu, whereas very few whiskers can be seen on those electroplated on the <111>− or the <100>-oriented Cu. It is also found that the behavior of intermetallic compound (IMC) growth at the Sn–Cu interface is quite different between the randomly- and specifically-oriented Cu films, which leads to divergent phenomena of Sn whisker growth. Furthermore, after 7944 h of RT storage, both the <111>− and the <100>-oriented Cu films are proven to be effective on preventing Sn whisker growth. Orientation analysis indicated the Sn grains on the <111>− and the <100>-oriented Cu possesses <110> preferred orientation, which may slow down the formation of the Cu–Sn IMCs. |
| format | Article |
| id | doaj-art-6a643ed5514b46fc827ac7cf344d64bb |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-03-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-6a643ed5514b46fc827ac7cf344d64bb2025-02-10T04:34:25ZengElsevierJournal of Materials Research and Technology2238-78542025-03-013532173225To suppress tin whisker growth by using (100)-oriented copperHan-Wen Lin0Jia-Ling Lu1Chih-Chia Hu2K.N. Tu3Chih Chen4Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 300093, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 300093, TaiwanDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 300093, TaiwanDepartment of Materials Science and Engineering, City University of Hong Kong, Hong Kong; Department of Electrical Engineering, City University of Hong Kong, Hong KongDepartment of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu, 300093, Taiwan; Corresponding author.Effect of Cu crystallographic orientations on the Sn whisker growth is investigated in this study. Three types of Cu under-layer (randomly, <111>, <100>-oriented) were prepared for electroplating of pure Sn. After 672 h of room temperature (RT) storage, a lot of whiskers were found on the Sn surface electroplated on the randomly-oriented Cu, whereas very few whiskers can be seen on those electroplated on the <111>− or the <100>-oriented Cu. It is also found that the behavior of intermetallic compound (IMC) growth at the Sn–Cu interface is quite different between the randomly- and specifically-oriented Cu films, which leads to divergent phenomena of Sn whisker growth. Furthermore, after 7944 h of RT storage, both the <111>− and the <100>-oriented Cu films are proven to be effective on preventing Sn whisker growth. Orientation analysis indicated the Sn grains on the <111>− and the <100>-oriented Cu possesses <110> preferred orientation, which may slow down the formation of the Cu–Sn IMCs.http://www.sciencedirect.com/science/article/pii/S2238785425002686 |
| spellingShingle | Han-Wen Lin Jia-Ling Lu Chih-Chia Hu K.N. Tu Chih Chen To suppress tin whisker growth by using (100)-oriented copper Journal of Materials Research and Technology |
| title | To suppress tin whisker growth by using (100)-oriented copper |
| title_full | To suppress tin whisker growth by using (100)-oriented copper |
| title_fullStr | To suppress tin whisker growth by using (100)-oriented copper |
| title_full_unstemmed | To suppress tin whisker growth by using (100)-oriented copper |
| title_short | To suppress tin whisker growth by using (100)-oriented copper |
| title_sort | to suppress tin whisker growth by using 100 oriented copper |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425002686 |
| work_keys_str_mv | AT hanwenlin tosuppresstinwhiskergrowthbyusing100orientedcopper AT jialinglu tosuppresstinwhiskergrowthbyusing100orientedcopper AT chihchiahu tosuppresstinwhiskergrowthbyusing100orientedcopper AT kntu tosuppresstinwhiskergrowthbyusing100orientedcopper AT chihchen tosuppresstinwhiskergrowthbyusing100orientedcopper |