An impermeable copper surface monolayer with high-temperature oxidation resistance
Abstract Despite numerous efforts involving surface coating, doping, and alloying, maintaining surface stability of metal at high temperatures without compromising intrinsic properties has remained challenging. Here, we present a pragmatic method to address the accelerated oxidation of Cu, Ni, and F...
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| Format: | Article |
| Language: | English |
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Nature Portfolio
2025-02-01
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| Series: | Nature Communications |
| Online Access: | https://doi.org/10.1038/s41467-025-56709-w |
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| author | Su Jae Kim Young-Hoon Kim Bipin Lamichhane Binod Regmi Yousil Lee Sang-Hyeok Yang Seon Je Kim Min-Hyoung Jung Jae Hyuck Jang Hu Young Jeong Miaofang Chi Maeng-Je Seong Hak Soo Choi Seong-Gon Kim Young-Min Kim Se-Young Jeong |
| author_facet | Su Jae Kim Young-Hoon Kim Bipin Lamichhane Binod Regmi Yousil Lee Sang-Hyeok Yang Seon Je Kim Min-Hyoung Jung Jae Hyuck Jang Hu Young Jeong Miaofang Chi Maeng-Je Seong Hak Soo Choi Seong-Gon Kim Young-Min Kim Se-Young Jeong |
| author_sort | Su Jae Kim |
| collection | DOAJ |
| description | Abstract Despite numerous efforts involving surface coating, doping, and alloying, maintaining surface stability of metal at high temperatures without compromising intrinsic properties has remained challenging. Here, we present a pragmatic method to address the accelerated oxidation of Cu, Ni, and Fe at temperatures exceeding 200 °C. Inspired by the concept that oxygen (O) itself can effectively obstruct the pathway of O infiltration, this study proposes the immobilization of O on the metal surface. Through extensive calculations considering various elements (C, Al, Si, Ge, Ga, In, and Sn) to anchor O on Cu surfaces, Si emerges as the optimal element. The theoretical findings are validated through systematic sputtering deposition experiments. The introduction of anchoring elements to reinforce Cu–O bonds enables the formation of an atomically thin barrier on the Cu surface, rendering it impermeable to O even at high temperatures (400 °C) while preserving its intrinsic conductivity. This oxidation resistance, facilitated by the impermeable atomic monolayer, opens promising opportunities for researchers and industries to overcome limitations associated with the use of oxidizable metal films. |
| format | Article |
| id | doaj-art-80320a9ece9444a5a5ae2530c17415cd |
| institution | Kabale University |
| issn | 2041-1723 |
| language | English |
| publishDate | 2025-02-01 |
| publisher | Nature Portfolio |
| record_format | Article |
| series | Nature Communications |
| spelling | doaj-art-80320a9ece9444a5a5ae2530c17415cd2025-02-09T12:44:54ZengNature PortfolioNature Communications2041-17232025-02-0116111110.1038/s41467-025-56709-wAn impermeable copper surface monolayer with high-temperature oxidation resistanceSu Jae Kim0Young-Hoon Kim1Bipin Lamichhane2Binod Regmi3Yousil Lee4Sang-Hyeok Yang5Seon Je Kim6Min-Hyoung Jung7Jae Hyuck Jang8Hu Young Jeong9Miaofang Chi10Maeng-Je Seong11Hak Soo Choi12Seong-Gon Kim13Young-Min Kim14Se-Young Jeong15Crystal Bank Research Institute, Pusan National UniversityDepartment of Energy Science, Sungkyunkwan UniversityDepartment of Physics and Astronomy, Mississippi State UniversityDepartment of Physics and Astronomy, Mississippi State UniversityCopper Innovative Technology (CIT) Co.Department of Energy Science, Sungkyunkwan UniversityDepartment of Energy Science, Sungkyunkwan UniversityDepartment of Energy Science, Sungkyunkwan UniversityElectron Microscopy Research Group, Korea Basic Science Institute (KBSI)Graduate School of Semiconductor Materials and Devices Engineering, Ulsan National Institute of Science and TechnologyCenter for Nanophase Materials Sciences, Oak Ridge National LaboratoryDepartment of Physics and Center for Berry Curvature-based New Phenomena, Chung-Ang UniversityGordon Center for Medical Imaging, Department of Radiology, Massachusetts General Hospital and Harvard Medical SchoolDepartment of Physics and Astronomy, Mississippi State UniversityDepartment of Energy Science, Sungkyunkwan UniversityGordon Center for Medical Imaging, Department of Radiology, Massachusetts General Hospital and Harvard Medical SchoolAbstract Despite numerous efforts involving surface coating, doping, and alloying, maintaining surface stability of metal at high temperatures without compromising intrinsic properties has remained challenging. Here, we present a pragmatic method to address the accelerated oxidation of Cu, Ni, and Fe at temperatures exceeding 200 °C. Inspired by the concept that oxygen (O) itself can effectively obstruct the pathway of O infiltration, this study proposes the immobilization of O on the metal surface. Through extensive calculations considering various elements (C, Al, Si, Ge, Ga, In, and Sn) to anchor O on Cu surfaces, Si emerges as the optimal element. The theoretical findings are validated through systematic sputtering deposition experiments. The introduction of anchoring elements to reinforce Cu–O bonds enables the formation of an atomically thin barrier on the Cu surface, rendering it impermeable to O even at high temperatures (400 °C) while preserving its intrinsic conductivity. This oxidation resistance, facilitated by the impermeable atomic monolayer, opens promising opportunities for researchers and industries to overcome limitations associated with the use of oxidizable metal films.https://doi.org/10.1038/s41467-025-56709-w |
| spellingShingle | Su Jae Kim Young-Hoon Kim Bipin Lamichhane Binod Regmi Yousil Lee Sang-Hyeok Yang Seon Je Kim Min-Hyoung Jung Jae Hyuck Jang Hu Young Jeong Miaofang Chi Maeng-Je Seong Hak Soo Choi Seong-Gon Kim Young-Min Kim Se-Young Jeong An impermeable copper surface monolayer with high-temperature oxidation resistance Nature Communications |
| title | An impermeable copper surface monolayer with high-temperature oxidation resistance |
| title_full | An impermeable copper surface monolayer with high-temperature oxidation resistance |
| title_fullStr | An impermeable copper surface monolayer with high-temperature oxidation resistance |
| title_full_unstemmed | An impermeable copper surface monolayer with high-temperature oxidation resistance |
| title_short | An impermeable copper surface monolayer with high-temperature oxidation resistance |
| title_sort | impermeable copper surface monolayer with high temperature oxidation resistance |
| url | https://doi.org/10.1038/s41467-025-56709-w |
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