Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor Fab
Abstract This study reviews the air pollution control strategy at an advanced semiconductor fab focusing on its continuous improvements and future challenges. A wide range of air pollutants is emitted from various sources classified as organic solvents, corrosive, toxic and combustible gases. This e...
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| Format: | Article |
| Language: | English |
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Springer
2023-04-01
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| Series: | Aerosol and Air Quality Research |
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| Online Access: | https://doi.org/10.4209/aaqr.230034 |
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| author | Hsueh-Hsing Lu Ming-Chun Lu Thi-Cuc Le Zhiping An David Y. H. Pui Chuen-Jinn Tsai |
| author_facet | Hsueh-Hsing Lu Ming-Chun Lu Thi-Cuc Le Zhiping An David Y. H. Pui Chuen-Jinn Tsai |
| author_sort | Hsueh-Hsing Lu |
| collection | DOAJ |
| description | Abstract This study reviews the air pollution control strategy at an advanced semiconductor fab focusing on its continuous improvements and future challenges. A wide range of air pollutants is emitted from various sources classified as organic solvents, corrosive, toxic and combustible gases. This effective strategy employs a two-stage treatment method to comply with national emission regulations. Eight different types of local scrubbers (typ. gas flow rate: 0.3–2.0 CMM for the dry type or 60–83.3 CMM for the wet type) are used as pre-treatment devices at the first stage to remove specific target pollutants with high concentrations emitted from process chambers. Exhaust gases from local scrubbers are then grouped and further treated by central control facilities at the second stage, including the dual zeolite rotor-concentrator plus the thermal oxidizer for VOCs (typ. gas flow rate: 2500 CMM), the dual-central wet scrubbers (CWS) and alkaline CWS (typ. gas flow rate: 2000 CMM) for acid and alkaline gases, respectively. After the two-stage treatment, the removal efficiency of the VOCs can reach higher than 98.4%, surpassing the emission standard of 90%. The design parameters and operating conditions of the CWSs meet the criteria set in the emission standard for the semiconductor industry. In the future, CWS performance can further be improved by using advanced structured packing materials with larger specific surface areas to shorten the residence time and lower the chemical dosing amount and pressure drop while achieving higher removal efficiency for acid and alkaline gases at a reduced operating cost. The challenges to removing derived fine PM and white smoke still remain which can be resolved by using efficient control devices in the pre- and post-treatment stages, such as wet electrostatic precipitators. Finally, the by-product NOx can be minimized by using low-NOx burners or de-NOx control technologies in the future. |
| format | Article |
| id | doaj-art-88ea00e480214d86868fe1338510c44f |
| institution | Kabale University |
| issn | 1680-8584 2071-1409 |
| language | English |
| publishDate | 2023-04-01 |
| publisher | Springer |
| record_format | Article |
| series | Aerosol and Air Quality Research |
| spelling | doaj-art-88ea00e480214d86868fe1338510c44f2025-02-09T12:22:43ZengSpringerAerosol and Air Quality Research1680-85842071-14092023-04-0123511910.4209/aaqr.230034Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor FabHsueh-Hsing Lu0Ming-Chun Lu1Thi-Cuc Le2Zhiping An3David Y. H. Pui4Chuen-Jinn Tsai5Institute of Environmental Engineering, National Yang Ming Chiao Tung UniversityInstitute of Environmental Engineering, National Yang Ming Chiao Tung UniversityInstitute of Environmental Engineering, National Yang Ming Chiao Tung UniversityInstitute of Environmental Engineering, National Yang Ming Chiao Tung UniversityMechanical Engineering Department, University of MinnesotaInstitute of Environmental Engineering, National Yang Ming Chiao Tung UniversityAbstract This study reviews the air pollution control strategy at an advanced semiconductor fab focusing on its continuous improvements and future challenges. A wide range of air pollutants is emitted from various sources classified as organic solvents, corrosive, toxic and combustible gases. This effective strategy employs a two-stage treatment method to comply with national emission regulations. Eight different types of local scrubbers (typ. gas flow rate: 0.3–2.0 CMM for the dry type or 60–83.3 CMM for the wet type) are used as pre-treatment devices at the first stage to remove specific target pollutants with high concentrations emitted from process chambers. Exhaust gases from local scrubbers are then grouped and further treated by central control facilities at the second stage, including the dual zeolite rotor-concentrator plus the thermal oxidizer for VOCs (typ. gas flow rate: 2500 CMM), the dual-central wet scrubbers (CWS) and alkaline CWS (typ. gas flow rate: 2000 CMM) for acid and alkaline gases, respectively. After the two-stage treatment, the removal efficiency of the VOCs can reach higher than 98.4%, surpassing the emission standard of 90%. The design parameters and operating conditions of the CWSs meet the criteria set in the emission standard for the semiconductor industry. In the future, CWS performance can further be improved by using advanced structured packing materials with larger specific surface areas to shorten the residence time and lower the chemical dosing amount and pressure drop while achieving higher removal efficiency for acid and alkaline gases at a reduced operating cost. The challenges to removing derived fine PM and white smoke still remain which can be resolved by using efficient control devices in the pre- and post-treatment stages, such as wet electrostatic precipitators. Finally, the by-product NOx can be minimized by using low-NOx burners or de-NOx control technologies in the future.https://doi.org/10.4209/aaqr.230034Semiconductor fabAir pollution controlVOCsAcid and alkaline gasesWhite smoke |
| spellingShingle | Hsueh-Hsing Lu Ming-Chun Lu Thi-Cuc Le Zhiping An David Y. H. Pui Chuen-Jinn Tsai Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor Fab Aerosol and Air Quality Research Semiconductor fab Air pollution control VOCs Acid and alkaline gases White smoke |
| title | Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor Fab |
| title_full | Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor Fab |
| title_fullStr | Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor Fab |
| title_full_unstemmed | Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor Fab |
| title_short | Continuous Improvements and Future Challenges of Air Pollution Control at an Advanced Semiconductor Fab |
| title_sort | continuous improvements and future challenges of air pollution control at an advanced semiconductor fab |
| topic | Semiconductor fab Air pollution control VOCs Acid and alkaline gases White smoke |
| url | https://doi.org/10.4209/aaqr.230034 |
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