Copper leaching with aqueous foams for the processing of electronic waste

Aqueous foams have been used in various hydrometallurgical processes, and have recently emerged as an alternative technique for the leaching of metallic copper, using hydrochloric acid and O2 from air as an oxidant. In the present study, we describe how this technique has been successfully applied t...

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Main Authors: Régnier, Emilie, Hubau, Agathe, Touzé, Solène, Guignot, Sylvain, Meyer, Daniel, Diat, Olivier, Bourgeois, Damien
Format: Article
Language:English
Published: Académie des sciences 2024-05-01
Series:Comptes Rendus. Chimie
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Online Access:https://comptes-rendus.academie-sciences.fr/chimie/articles/10.5802/crchim.311/
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author Régnier, Emilie
Hubau, Agathe
Touzé, Solène
Guignot, Sylvain
Meyer, Daniel
Diat, Olivier
Bourgeois, Damien
author_facet Régnier, Emilie
Hubau, Agathe
Touzé, Solène
Guignot, Sylvain
Meyer, Daniel
Diat, Olivier
Bourgeois, Damien
author_sort Régnier, Emilie
collection DOAJ
description Aqueous foams have been used in various hydrometallurgical processes, and have recently emerged as an alternative technique for the leaching of metallic copper, using hydrochloric acid and O2 from air as an oxidant. In the present study, we describe how this technique has been successfully applied to the leaching of copper from waste printed circuits boards (WPCBs). First of all, the use of HCl based foams was successfully applied to the leaching of sole copper, and the impact of the size of copper particles was studied. It was demonstrated that use of mixtures of fine and large particles give excellent results. Then, on ground WPCBs, a first classical leaching stage using aqueous HCl solution was performed in order to remove maximum quantity of reducible metals (aluminum, iron, zinc ...). Then, almost quantitative copper leaching employing HCl based foam was performed. Copper is almost exclusively leached during this stage, and the complete mass balance in 5 major metals present in WPCBs (aluminum, iron, zinc, nickel and copper) is detailed. Kinetics of the copper leaching were greatly enhanced through addition of substoechiometric quantity of cupric ions at the beginning of the process, so that extensive grinding of the waste is not necessary.
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spelling doaj-art-c31bc7551e5f413e84e697f055cb56d52025-02-07T13:41:01ZengAcadémie des sciencesComptes Rendus. Chimie1878-15432024-05-011910.5802/crchim.31110.5802/crchim.311Copper leaching with aqueous foams for the processing of electronic wasteRégnier, Emilie0Hubau, Agathe1https://orcid.org/0000-0002-3896-7220Touzé, Solène2https://orcid.org/0000-0002-0840-4494Guignot, Sylvain3https://orcid.org/0000-0001-6449-1337Meyer, Daniel4Diat, Olivier5https://orcid.org/0000-0003-3011-8168Bourgeois, Damien6https://orcid.org/0000-0002-0762-3476Institut de Chimie Séparative de Marcoule, ICSM, CEA, CNRS, ENSCM, Univ Montpellier, BP 17171, Marcoule, 30207 Bagnols-sur-Cèze, FranceBRGM, F-45060 Orléans, FranceBRGM, F-45060 Orléans, FranceBRGM, F-45060 Orléans, FranceInstitut de Chimie Séparative de Marcoule, ICSM, CEA, CNRS, ENSCM, Univ Montpellier, BP 17171, Marcoule, 30207 Bagnols-sur-Cèze, FranceInstitut de Chimie Séparative de Marcoule, ICSM, CEA, CNRS, ENSCM, Univ Montpellier, BP 17171, Marcoule, 30207 Bagnols-sur-Cèze, FranceInstitut de Chimie Séparative de Marcoule, ICSM, CEA, CNRS, ENSCM, Univ Montpellier, BP 17171, Marcoule, 30207 Bagnols-sur-Cèze, FranceAqueous foams have been used in various hydrometallurgical processes, and have recently emerged as an alternative technique for the leaching of metallic copper, using hydrochloric acid and O2 from air as an oxidant. In the present study, we describe how this technique has been successfully applied to the leaching of copper from waste printed circuits boards (WPCBs). First of all, the use of HCl based foams was successfully applied to the leaching of sole copper, and the impact of the size of copper particles was studied. It was demonstrated that use of mixtures of fine and large particles give excellent results. Then, on ground WPCBs, a first classical leaching stage using aqueous HCl solution was performed in order to remove maximum quantity of reducible metals (aluminum, iron, zinc ...). Then, almost quantitative copper leaching employing HCl based foam was performed. Copper is almost exclusively leached during this stage, and the complete mass balance in 5 major metals present in WPCBs (aluminum, iron, zinc, nickel and copper) is detailed. Kinetics of the copper leaching were greatly enhanced through addition of substoechiometric quantity of cupric ions at the beginning of the process, so that extensive grinding of the waste is not necessary.https://comptes-rendus.academie-sciences.fr/chimie/articles/10.5802/crchim.311/FoamsCopperLeachingShredding
spellingShingle Régnier, Emilie
Hubau, Agathe
Touzé, Solène
Guignot, Sylvain
Meyer, Daniel
Diat, Olivier
Bourgeois, Damien
Copper leaching with aqueous foams for the processing of electronic waste
Comptes Rendus. Chimie
Foams
Copper
Leaching
Shredding
title Copper leaching with aqueous foams for the processing of electronic waste
title_full Copper leaching with aqueous foams for the processing of electronic waste
title_fullStr Copper leaching with aqueous foams for the processing of electronic waste
title_full_unstemmed Copper leaching with aqueous foams for the processing of electronic waste
title_short Copper leaching with aqueous foams for the processing of electronic waste
title_sort copper leaching with aqueous foams for the processing of electronic waste
topic Foams
Copper
Leaching
Shredding
url https://comptes-rendus.academie-sciences.fr/chimie/articles/10.5802/crchim.311/
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AT guignotsylvain copperleachingwithaqueousfoamsfortheprocessingofelectronicwaste
AT meyerdaniel copperleachingwithaqueousfoamsfortheprocessingofelectronicwaste
AT diatolivier copperleachingwithaqueousfoamsfortheprocessingofelectronicwaste
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