Maximally PCB-Space-Saving Hybrid Integration of Millimeter-Wave and Microwave Antennas for 5G and B5G Smartphones

Maximally PCB-Space-Saving Hybrid Integration of Millimeter-Wave and Microwave Antennas for 5G and B5G Smartphones

This paper proposes a simple, low-cost, and practical hybrid integration design of a 5G FR2 millimeter-wave antenna module based on a thin flexible printed circuit (FPC) and a 5G FR1 microwave antenna based on a metal frame to maximally save precious printed circuit board (PCB) space for more compet...

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Bibliographic Details
Main Authors: Huan-Chu Huang, Jie Wu, Shuang Cui
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Access
Subjects:
5G
6G
B5G
antennas
integration
microwave
Online Access:https://ieeexplore.ieee.org/document/10858119/
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https://ieeexplore.ieee.org/document/10858119/

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