Computational analysis of heat transfer and fluid flow characteristics in a diamond microchannel heat sink with orthogonal ribs
As electronic devices advance toward higher power densities and increased miniaturization, the resulting rise in heat flux presents significant challenges to their performance, reliability, operational lifespan, and energy efficiency. Effective thermal management technologies ensure that electronic...
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Main Authors: | , , , , |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2025-03-01
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Series: | Case Studies in Thermal Engineering |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2214157X25001108 |
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