CHARACTERIZATION OF RHEOLOGICAL PROPERTIES OF SEMISOLID MATERIALS USED AS THERMAL INTERFACES. PART I: A BRIEF REVIEW
In optimizing the performances of electronic devices, the semisolids used as thermal pastes have a significant part. The interface material should have a good compliance to follow the shape of the contacting surfaces and higher spreadability but also, have increased filler content for high thermal...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Alma Mater Publishing House "Vasile Alecsandri" University of Bacau
2015-12-01
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| Series: | Journal of Engineering Studies and Research |
| Subjects: | |
| Online Access: | https://jesr.ub.ro/index.php/1/article/view/128 |
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