Co-Optimization of Power Delivery Network Design for 3-D Heterogeneous Integration of RRAM-Based Compute In-Memory Accelerators

Three-dimensional heterogeneous integration (3D-HI) offers promising solutions for incorporating substantial embedded memory into cutting-edge analog compute-in-memory (CIM) AI accelerators, addressing the need for on-chip acceleration of large AI models. However, this approach faces challenges with...

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Bibliographic Details
Main Authors: Madison Manley, James Read, Ankit Kaul, Shimeng Yu, Muhannad Bakir
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Subjects:
Online Access:https://ieeexplore.ieee.org/document/10854426/
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